X-ray Inspection

Precise Inspection of Electronic and Mechanical Components

We offer high-resolution, non-destructive inspection methods for analyzing electronic and mechanical components. Our methods provide detailed insights into the structure and quality of your components, making them ideal for quality assurance, damage analysis, and research.

Scope of Services

• X-ray Inspection: High-precision analysis of components to detect defects such as voids, cracks, delaminations, or insufficient solder joints.
• Laminography: Layer-by-layer examination of complex or multi-layer components, such as multilayer printed circuit boards or parts with hidden structures.

Typical Applications

• Inspection of printed circuit boards (PCBs), ICs, BGA components, and other electronic parts
• Identification of production defects or damage caused by thermal and mechanical stress
• Analysis of material structures and components made of metal, plastic, or composite materials
• Detection of manufacturing defects, cracks, or voids

Technical Equipment

Our inspections are conducted using a Cheetah EVO from Comet Yxlon, a state-of-the-art X-ray system known for its excellent image quality and versatility. The system offers:

• High-resolution X-ray imaging: Precise detection of even the smallest defects in a wide range of materials.
• Laminography option: Enables layer-by-layer analysis of complex structures, such as multilayer PCBs or concealed components.
• Flexibility: Adaptable to various component sizes and inspection requirements.

The Cheetah EVO ensures that even demanding inspection tasks are performed reliably and efficiently.

Your Benefits

• Non-destructive testing: Analysis without damaging or altering the components.
• High precision: Detection of even the smallest defects and flaws.
• Flexibility: Suitable for inspecting a wide range of materials and component geometries.

Contact

For detailed information or to discuss your specific inspection requirements, please feel free to contact us: